As part of the French Recovery Plan, Teledyne e2v Semiconductors and Safran Electronics Defense have jointly obtained a French state aid to develop their System-in-Package roadmap
- Written by Teledyne e2v
GRENOBLE, FRANCE - Media OutReach - 18 June 2021 - Teledyne e2v Semiconductors (Grenoble) and Safran Electronics & Defense (Valence), are currently launching the CORAIL SiP (System-in-Package) project with a significant state aid from the French government. The CORAIL SiP project was created to accelerate investments in order to boost...